Title :
Electrical characterization of interconnects and materials for high speed computer packaging system
Author :
Arabi, Tawfik ; Pomerleau, Real ; Jong, Jyh-Ming ; Tripathi, Vijai K.
Author_Institution :
Intel Corp., Hillsboro, OR, USA
Abstract :
A technique for the wide band characterization of the interconnect losses in printed circuit boards is presented. The accuracy of the technique is enhanced by using time domain transformations to virtually eliminate the FFT associated errors. The de-embedding procedure applied in this paper is well suited to the wide band characterization of dielectric materials in a production like environment. The usefulness and accuracy of the approach is demonstrated by measurements
Keywords :
packaging; FFT errors; deembedding procedure; dielectric materials; electrical characterization; high speed computer packaging system; interconnect characterisation; interconnect losses; materials characterisation; printed circuit boards; production environment; time domain transformations; wideband characterization; Bandwidth; Costs; Dielectric losses; Dielectric materials; Integrated circuit interconnections; Optical pulse generation; Packaging; Pulse measurements; Space vector pulse width modulation; Wideband;
Conference_Titel :
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-2411-0
DOI :
10.1109/EPEP.1994.594140
