Title :
Electrical characterization of VLSI packages
Author :
Perezalonso, F. ; Crawford, Bob ; Bernard, Ron ; Kaw, Ravi ; Thomas, Steve ; Bogatin, Eric
Author_Institution :
Hewlett-Packard Co., Palo Alto, CA, USA
Abstract :
The authors define, verify, and demonstrate measurement instruments and test fixtures required to successfully characterize IC packages electrically for low-frequency applications (<50 MHz). Three fundamentally different measurement techniques were evaluated. One uses the HP 4191A RF Impedance Analyzer instrument, which measures the frequency-domain reflection coefficient and phase angle of any load and calculates its impedance. Another measurement technique uses the HP 4194A Impedance/Gain Phase Analyzer, which measures the frequency-domain voltage across the test load generated by the current through its magnitude and phase shift. The other measurement technique is called ramp-derivative; its measurement principle is based on the time domain transient response and the fundamental definition of resistance, inductance, and capacitance to determine their respective values
Keywords :
VLSI; capacitance measurement; inductance measurement; packaging; 1 to 50 MHz; HP 4191A; HP 4194A; Impedance/Gain Phase Analyzer; RF Impedance Analyzer instrument; VLSI packages; capacitance measurement; electrical characterization; electrical parasitics; frequency-domain reflection coefficient; frequency-domain voltage; inductance measurement; low-frequency applications; measurement instruments; measurement techniques; parasitic capacitance; parasitic inductance; ramp-derivative; test fixtures; time domain transient response; Electric variables measurement; Electrical resistance measurement; Frequency domain analysis; Frequency measurement; Impedance measurement; Instruments; Measurement techniques; Packaging; Phase measurement; Very large scale integration;
Conference_Titel :
Electronic Components and Technology Conference, 1991. Proceedings., 41st
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-0012-2
DOI :
10.1109/ECTC.1991.163855