Title :
3-D electromagnetic field analysis of interconnections in copper-polyimide multichip modules
Author :
Sasaki, Shinichi ; Konno, Riyo ; Tomimuro, Hisashi ; Ohsaki, Takaaki
Author_Institution :
NTT Appl. Electron. Lab., Tokyo, Japan
Abstract :
The authors describe three-dimensional electromagnetic field analysis of interconnections in copper-polyimide multichip modules. This analysis is based on the spatial network method, a lattice network model of Maxwell´s equation formulated in the time domain by Bergeron´s method. Results of simulating reflection and transmission waves at interconnections are presented. Frequency characteristics of the scattering parameter S21 are calculated using the fast Fourier transform. The 3-dB down cutoff frequencies of wire-bonded, TAB (tape automated bonding), and FCB (flip-chip bonding) interconnections are respectively 6, 14, and 40 GHz. Those of the interconnection vias are over 200 GHz
Keywords :
flip-chip devices; hybrid integrated circuits; lead bonding; microwave integrated circuits; tape automated bonding; 3D analysis; 6 to 200 GHz; Bergeron´s method; FCB; Maxwell´s equation; S21; TAB; cutoff frequencies; electromagnetic field analysis; fast Fourier transform; flip-chip bonding; interconnection vias; interconnections; lattice network model; multichip modules; reflection waves; scattering parameter; spatial network method; tape automated bonding; transmission waves; wire bonded connections; Bonding; Electromagnetic analysis; Electromagnetic fields; Electromagnetic reflection; Frequency; Lattices; Maxwell equations; Multichip modules; Scattering parameters; Time domain analysis;
Conference_Titel :
Electronic Components and Technology Conference, 1991. Proceedings., 41st
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-0012-2
DOI :
10.1109/ECTC.1991.163856
