Hybrid technologies for high frequency switching power supplies

The authors review the technical requirements and driving forces leading to the introduction of fourth-generation high-frequency power supplies in advanced computers and telecommunication equipment. Thermal management, a critical issue for all power designs, was the subject of an experimental study. A 100-W DC-DC converter was designed and built using insulated metal substrate, FR4, and thick-film technologies. Using conventional thick-film technology, the board area was reduced by 44% over FR4 construction. An experimental substrate material of high thermal conductivity in combination with copper thick-film conductions was used to reduce the size of a converter to 39% of the original FR4 design. Computer modeling was used extensively in the design process. The properties and comparative performance of material systems are tabulated