Title :
Measurements on the electrical properties of transmission lines on flexible circuits
Author :
Simsek, A. ; Owzar, A. ; Eder, A.
Author_Institution :
Tech. Univ. Berlin, Germany
Abstract :
A flexible-circuit-packaging technology for TAB (tape automated bonding) devices has been explored. A Super-35 mm tape as a test vehicle has been designed, fabricated and tested to assess the electrical properties of the polyimide substrates and their advantages in packaging applications. Line geometries are referred to as used on typical TAB devices. The electrical design and characterization of the demonstrator are described in this paper
Keywords :
flexible structures; 35 mm; Super-35 mm tape; TAB devices; electrical properties; flexible circuits; packaging; polyimide substrates; tape automated bonding; transmission lines; Attenuation; Distributed parameter circuits; Electric variables measurement; Electrical resistance measurement; Flexible printed circuits; Geometry; Impedance; Testing; Transmission line measurements; Vehicles;
Conference_Titel :
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-2411-0
DOI :
10.1109/EPEP.1994.594144
