DocumentCode
2030977
Title
A low temperature cofired multilayer ceramic delay line with copper conductors
Author
Mandai, Harufumi ; Chigodo, Yoshikazu ; Tojo, Atushi
Author_Institution
Murata Manufacturing Co. Ltd., Kyto, Japan
fYear
1991
fDate
11-16 May 1991
Firstpage
127
Lastpage
133
Abstract
A distributed type chip delay line made of low-temperature fireable ceramics cofired with copper conductors has been developed. This product has very good stability at high frequency, metal shield layers built inside the chip, and features high reliability. This delay line is expected to be used for various high-frequency circuits, especially those requiring small devices: optical link interfaces, high-frequency measurement equipment, and supercomputers, for example
Keywords
ceramics; copper; delay lines; equivalent circuits; thick film circuits; Cu conductors; MLC; cofired multilayer ceramic delay line; distributed type chip delay line; high-frequency circuits; low-temperature fireable ceramics; metal shield layers; reliability; stability; Ceramics; Circuit stability; Conductors; Copper; Delay lines; Frequency; Nonhomogeneous media; Optical fiber communication; Semiconductor device measurement; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1991. Proceedings., 41st
Conference_Location
Atlanta, GA
Print_ISBN
0-7803-0012-2
Type
conf
DOI
10.1109/ECTC.1991.163864
Filename
163864
Link To Document