• DocumentCode
    2031009
  • Title

    Investigation of the adhesion mechanism of NiCr layers on Al2 O3 and AlN substrates

  • Author

    Feil, Michael ; Mader, Werner

  • Author_Institution
    Fraunhofer-Inst. fur Festkorpertechnol., Munchen, Germany
  • fYear
    1991
  • fDate
    11-16 May 1991
  • Firstpage
    134
  • Lastpage
    140
  • Abstract
    Sputtered NiCr layers on Al2O3 and AlN substrates show a very high adhesive strength in pull tests. An effort was made to investigate, with analytical procedures, the adhesion mechanism responsible for this. For the characterization of the surfaces and layers, element analyses were carried out with X-ray photoelectron spectroscopy and Auger electron spectroscopy. High-resolution transmission electron microscopy (HRTEM) studies were performed on a qualitative basis in order to obtain lattice fringes and lattice images of the thin overlayer and the substrate in near-interface regions. The results obtained lead to the conclusion that, with both ceramics, the good adhesion is due to the chemical bonding between Cr, Al, and O
  • Keywords
    Auger effect; X-ray photoelectron spectra; aluminium compounds; ceramics; chromium alloys; metallic thin films; metallisation; nickel alloys; sputtered coatings; substrates; thin film circuits; transmission electron microscope examination of materials; Al2O3 substrates; AlN substrates; Auger electron spectroscopy; HRTEM; NiCr-Al2O3; NiCr-AlN; X-ray photoelectron spectroscopy; adhesion mechanism; adhesive strength; characterization; chemical bonding; element analyses; lattice fringes; lattice images; pull tests; thin overlayer; Adhesive strength; Bonding; Ceramics; Chemicals; Chromium; Lattices; Spectroscopy; Testing; Transmission electron microscopy; X-ray imaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1991. Proceedings., 41st
  • Conference_Location
    Atlanta, GA
  • Print_ISBN
    0-7803-0012-2
  • Type

    conf

  • DOI
    10.1109/ECTC.1991.163865
  • Filename
    163865