DocumentCode :
2031083
Title :
A 3D Network-on-Chip for stacked-die transactional chip multiprocessors using Through Silicon Vias
Author :
Kumar, Sumeet S. ; Van Leuken, Rene
Author_Institution :
Circuits & Syst. Group, Delft Univ. of Technol., Delft, Netherlands
fYear :
2011
fDate :
6-8 April 2011
Firstpage :
1
Lastpage :
6
Abstract :
Effective utilization of computing power offered by modern chip multiprocessors (CMP) depends on the design and performance of the interconnect that connects them. We present a three-dimensional Network-on-Chip (NoC) based on the R3 router architecture for transactional CMPs utilizing advanced Through Silicon Vias (TSV) in a stacked-die architecture, facilitating low latency and high throughput communication between CMP nodes. We report the performance of an R3 based three-dimensional mesh in a stacked-die transactional CMP highlighting the limitations of performance scale-up with stacking. Furthermore, we present data on area penalty associated with the use of TSVs in different configurations in 90nm UMC technology.
Keywords :
integrated circuit design; multiprocessor interconnection networks; network routing; network-on-chip; three-dimensional integrated circuits; 3D network-on-chip; CMP nodes; R3 router architecture; TSV; UMC technology; interconnect design; size 90 nm; stacked-die architecture; stacked-die transactional CMP; stacked-die transactional chip multiprocessors; three-dimensional NoC; three-dimensional mesh; through silicon vias; Integrated circuit interconnections; Payloads; Routing; Silicon; Three dimensional displays; Through-silicon vias; Throughput; Mul-ticore processing; Multiprocessor interconnection networks; Three-dimensional integrated circuits; Through-Silicon Vias;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design & Technology of Integrated Systems in Nanoscale Era (DTIS), 2011 6th International Conference on
Conference_Location :
Athens
Print_ISBN :
978-1-61284-899-0
Type :
conf
DOI :
10.1109/DTIS.2011.5941443
Filename :
5941443
Link To Document :
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