DocumentCode
2031271
Title
Electromagnetic modeling of simultaneous switching noise in power and ground planes in electronic packages
Author
Mittra, Raj ; Chebolu, Siva
Author_Institution
Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
fYear
1994
fDate
2-4 Nov 1994
Firstpage
207
Lastpage
210
Abstract
Accurate modeling of power and ground planes in electronic packages is an important problem from the point of view of extracting the equivalent effective inductance and using it to estimate the simultaneous switching noise (SSO). In this paper, we present two different approaches to calculating the effective inductance of power and ground planes. The first of these, which is based upon a quasi-magnetostatic analysis using the Method of Moments, is applied to the problem of computing the self and mutual inductances of the pins in a typical TAB package. Next, the Finite Difference Time Domain (FDTD) approach is used to model complex power plane structures with multiple planes, transmission lines and vias, and a technique for extracting the effective inductance of such structures is described. A discussion on the relative advantages and disadvantages of the two methods is included in the paper
Keywords
packaging; TAB package; electromagnetic modeling; electronic packages; equivalent effective inductance; finite difference time domain method; ground planes; method of moments; multiple planes; mutual inductance; pins; power planes; quasi-magnetostatic analysis; self inductance; simultaneous switching noise; transmission lines; vias; Circuit noise; Electromagnetic interference; Electromagnetic modeling; Electronics packaging; Finite difference methods; Inductance; Pins; Switches; Switching circuits; Time domain analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location
Monterey, CA
Print_ISBN
0-7803-2411-0
Type
conf
DOI
10.1109/EPEP.1994.594146
Filename
594146
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