Title :
Model of interaction between signal vias and metal planes in electronics packaging
Author :
Fang, Jiayuan ; Chen, Yuzhe ; Wu, Zhonghua ; Xue, Danwei
Author_Institution :
Dept. of Electr. Eng., State Univ. of New York, Binghamton, NY, USA
Abstract :
In electronics packaging, currents flowing through signal vias can generate voltage fluctuations between metal planes. Likewise, voltage fluctuations between metal planes can induce currents in signal vias, and result in degradation of the signal integrity. This paper presents a simple model which can effectively represent the interaction between signal vias and metal planes
Keywords :
packaging; currents; electronics packaging; metal planes; signal integrity; signal vias; voltage fluctuations; Contracts; Degradation; Electromagnetic scattering; Electronics packaging; Power generation; Predictive models; Resonance; Signal generators; Supercomputers; Voltage fluctuations;
Conference_Titel :
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-2411-0
DOI :
10.1109/EPEP.1994.594147
