DocumentCode
2031606
Title
A novel stretchable CMUT array using liquid-metal electrodes on a PDMS substrate
Author
Shi, Xiaomei ; Cheng, Ching-Hsiang ; Peng, Jue
Author_Institution
Dept. of Ind. & Syst. Eng., Hong Kong Polytech. Univ., Hong Kong, China
fYear
2012
fDate
5-8 March 2012
Firstpage
104
Lastpage
107
Abstract
This paper introduces a new method for fabricating a stretchable capacitive micromachined ultrasonic transducer (CMUT) array with liquid-metal (Ga-In-Sn) electrodes on a polydimethylsiloxane (PDMS) substrate. A stretchable CMUT array can make it fully comply with a 3D curved surface for biomedical applications. The transducer membrane and cavity are fabricated separately using PDMS and bonded together by using O2 plasma, which allows us to form the concave bottom electrodes on top of the reflowed photoresist. By using concave bottom electrodes, the effective capacitance will be increased by reducing the gap distance on the membrane edge, especially when pulled in by a DC bias. This can increase the device sensitivity, fill factor and output pressure. The device is designed to operate in the range of 100 kHz to 500 kHz for low frequency applications. The preliminary experimental results show a resonant frequency at around 200 kHz by using an impedance analyzer.
Keywords
acoustic impedance; acoustic resonance; capacitance; electrodes; gallium alloys; indium alloys; liquid metals; membranes; photoresists; tin alloys; ultrasonic transducer arrays; 3D curved surface; CMUT array; GaInSn; biomedical applications; capacitance; cavity; impedance analyzer; liquid-metal electrodes; photoresist; polydimethylsiloxane substrate; resonant frequency; stretchable capacitive micromachined ultrasonic transducer array; transducer membrane; Arrays; Biomedical imaging; Fabrication; Polymers; Resists; Sensitivity; capacitive micromachined ultrasonic transducer; concave bottom electrode; liquid metal; polydimethylsiloxane (PDMS) substrate;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems (NEMS), 2012 7th IEEE International Conference on
Conference_Location
Kyoto
Print_ISBN
978-1-4673-1122-9
Type
conf
DOI
10.1109/NEMS.2012.6196733
Filename
6196733
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