Title :
Optoelectronics packaging needs for data communications
Author :
Warren, Richard ; Lasky, Ronald ; Radcliffe, Jerry ; Stigliani, Daniel
Author_Institution :
IBM Corp., Endicott, NY, USA
Abstract :
It is pointed out that the growth of optoelectronics in the telecommunications marketplace has been steadily increasing since 1970. This technology is now migrating into data communications applications. However, the technical challenges of data communications are significantly different to those of telecommunications. The authors examine the marketing potential of data and elaborate the technical differences between data communications and telecommunications environments. Key technical elements are identified along with relative cost implications. Five technology challenges and their impact on data communications technology products are discussed
Keywords :
data communication equipment; optoelectronic devices; packaging; data communications; marketing potential; optoelectronics; packaging; technology challenges; telecommunications environments; Bandwidth; Communication industry; Computer industry; Copper; Costs; Data communication; Optical fiber cables; Packaging; Telecommunications; Throughput;
Conference_Titel :
Electronic Components and Technology Conference, 1991. Proceedings., 41st
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-0012-2
DOI :
10.1109/ECTC.1991.163870
