Title :
Incorporating SIMS Structures in Product Wafers in Order to Perform SIMS and other Material Analysis and Achieve Wafer Level Information about the Front-End Processing
Author :
Budri, Thanas ; Krott, Loren ; Patel, Neil ; Smith, Aaron ; Gurcan, Burcay ; Crocker, Kendra ; Supczak, Randy ; Printy, Craig
Author_Institution :
National Semicond., South Portland, ME
Abstract :
In this paper, we summarize how the introduction of SIMS structures near the global alignment marks of product wafers serve as an additional way to acquire detailed analytical information about front-end processing and can minimize product yield loss without waiting for metal 1 processing when electrical testing (ET) becomes possible
Keywords :
materials testing; process monitoring; secondary ion mass spectroscopy; semiconductor technology; SIMS structures; electrical testing; front end processing; global alignment marks; material analysis; product wafers; wafer level information; Electron beams; Implants; Information analysis; Performance analysis; Probes; Semiconductor materials; Silicon germanium; Substrates; Testing; Transistors;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference, 2006. ASMC 2006. The 17th Annual SEMI/IEEE
Conference_Location :
Boston, MA
Print_ISBN :
1-4244-0254-9
DOI :
10.1109/ASMC.2006.1638717
