Filler treatment effects on the dielectric properties of a filled epoxy resin

Author

Adohi, I.P. ; Guillermin, C. ; Rain, P. ; Rowe, S.W.

Author_Institution

Lab. d´´Electrostatique et de Materiaux Dielectriques, CNRS, Grenoble, France

fYear

2004

fDate

17-20 Oct. 2004

Firstpage

158

Lastpage

161

Abstract

The dielectric properties of an epoxy resin have been investigated over a wide range of frequencies (1 mHz-1 MHz), as a function of the temperature (30°C-100°C) and under various hygroscopic conditions. The matrix was either filler-free or filled with silica, (60% by weight). Samples with silica fillers, baked at high temperature, were also investigated. This treatment is thought to inhibit water ingress at the filler/matrix interfaces. An increase of both ε\´ and ε" has been observed above T_g at low frequencies. The influence of water content on interfacial polarisation has been studied. High temperature treatment of the filler is shown to decrease interfacial polarisation.

Keywords

dielectric losses; dielectric polarisation; filled polymers; heat treatment; permittivity; 1 mHz to 1 MHz; 30 to 100 degC; SiO₂; dielectric constant; filled epoxy resin dielectric properties; filler/matrix interfaces; high temperature baking; high temperature treatment; hygroscopic conditions; interfacial polarisation; loss factor; resin filler treatment effects; silica fillers; water content; water ingress inhibition; Dielectrics; Epoxy resins; Frequency; Glass; Mechanical factors; Minerals; Polarization; Silicon compounds; Temperature; Thermal conductivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Insulation and Dielectric Phenomena, 2004. CEIDP '04. 2004 Annual Report Conference on

Print_ISBN

0-7803-8584-5

Type

conf

DOI

10.1109/CEIDP.2004.1364213

Filename

1364213