Title :
Filler treatment effects on the dielectric properties of a filled epoxy resin
Author :
Adohi, I.P. ; Guillermin, C. ; Rain, P. ; Rowe, S.W.
Author_Institution :
Lab. d´´Electrostatique et de Materiaux Dielectriques, CNRS, Grenoble, France
Abstract :
The dielectric properties of an epoxy resin have been investigated over a wide range of frequencies (1 mHz-1 MHz), as a function of the temperature (30°C-100°C) and under various hygroscopic conditions. The matrix was either filler-free or filled with silica, (60% by weight). Samples with silica fillers, baked at high temperature, were also investigated. This treatment is thought to inhibit water ingress at the filler/matrix interfaces. An increase of both ε\´ and ε" has been observed above Tg at low frequencies. The influence of water content on interfacial polarisation has been studied. High temperature treatment of the filler is shown to decrease interfacial polarisation.
Keywords :
dielectric losses; dielectric polarisation; filled polymers; heat treatment; permittivity; 1 mHz to 1 MHz; 30 to 100 degC; SiO2; dielectric constant; filled epoxy resin dielectric properties; filler/matrix interfaces; high temperature baking; high temperature treatment; hygroscopic conditions; interfacial polarisation; loss factor; resin filler treatment effects; silica fillers; water content; water ingress inhibition; Dielectrics; Epoxy resins; Frequency; Glass; Mechanical factors; Minerals; Polarization; Silicon compounds; Temperature; Thermal conductivity;
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 2004. CEIDP '04. 2004 Annual Report Conference on
Print_ISBN :
0-7803-8584-5
DOI :
10.1109/CEIDP.2004.1364213
