DocumentCode :
2032287
Title :
Review of European packaging research and development activities
Author :
Reichl, Herbert
Author_Institution :
FhG-IZM, Berlin, Germany
fYear :
1994
fDate :
2-4 Nov 1994
Firstpage :
225
Lastpage :
228
Abstract :
Packaging techniques are considered under the aspect of reliability and minimum cost. Packaging development is concentrated on the task to find technologies to fulfil the requirement for low cost of material, process and equipment (low cost packaging technologies) and it is shown that advanced packaging technologies are the key for attractive future electronic products
Keywords :
Bonding; Ceramics; Costs; Electronics packaging; Europe; Lead; Nonhomogeneous media; Packaging machines; Research and development; Surface-mount technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-2411-0
Type :
conf
DOI :
10.1109/EPEP.1994.594154
Filename :
594154
Link To Document :
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