Title :
Review of European packaging research and development activities
Author_Institution :
FhG-IZM, Berlin, Germany
Abstract :
Packaging techniques are considered under the aspect of reliability and minimum cost. Packaging development is concentrated on the task to find technologies to fulfil the requirement for low cost of material, process and equipment (low cost packaging technologies) and it is shown that advanced packaging technologies are the key for attractive future electronic products
Keywords :
Bonding; Ceramics; Costs; Electronics packaging; Europe; Lead; Nonhomogeneous media; Packaging machines; Research and development; Surface-mount technology;
Conference_Titel :
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-2411-0
DOI :
10.1109/EPEP.1994.594154