Title :
The interconnected mesh power system (IMPS) MCM topology
Author :
Low, Y.L. ; Schaper, L.W. ; Ang, S. ; Oldham, D.
Author_Institution :
High Density Electron. Center, Arkansas Univ., Fayetteville, AR, USA
Abstract :
A new MCM design topology, the interconnected Mesh Power System (IMPS), which reduces the conventional four layer MCM to a two layer structure is presented. The characterization of power distribution and signal transmission properties of IMPS are discussed
Keywords :
interconnected systems; IMPS; MCM topology; design topology; interconnected mesh power system; power distribution; signal transmission; two layer structure; Circuit topology; Costs; Crosstalk; Geometry; Impedance; Microstrip; Power distribution; Power system interconnection; Signal design; Solids;
Conference_Titel :
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-2411-0
DOI :
10.1109/EPEP.1994.594155
