Title :
Rapid thermal plasma deposition of transparent nanocrystalline ZnO thin films and the effects of annealing
Author :
Teh, Kwok Siong ; Pedersen, Joachim ; Esposito, Heather
Author_Institution :
Sch. of Eng., San Francisco State Univ., San Francisco, CA, USA
Abstract :
Conductive, undoped zinc oxide nanocrystalline thin film with predominant c-axis orientation is prepared on crystalline and amorphous substrates using a rapid, one-step ambient-pressure, thermal plasma chemical vapor deposition process. Nonporous and conformal zinc oxide films can be prepared at temperature as low as 160°C, with an average grain size of 25 nm. Scanning electron micrographs indicate a growth rate of 15~50 nm/min, depending on factor including source temperature, deposition temperature, and pressure. X-ray diffraction shows a predominant (002) grain orientation that is independent of the substrate´s crystallinity. For films with thickness of 200 nm, the average electrical conductivity ranges from 60-910 S/m. The results demonstrate the potential of thermal plasma CVD for the rapid synthesis of conductive zinc oxide film at ambient condition.
Keywords :
II-VI semiconductors; X-ray diffraction; annealing; conducting materials; electrical conductivity; grain size; nanofabrication; nanoporous materials; plasma CVD; rapid thermal processing; scanning electron microscopy; semiconductor growth; semiconductor thin films; transparency; wide band gap semiconductors; zinc compounds; X-ray diffraction; ZnO; amorphous substrates; annealing; chemical vapor deposition; conductive transparent nanocrystalline thin films; crystallinity; electrical conductivity; grain orientation; grain size; nanoporosity; rapid thermal plasma deposition; scanning electron micrography; size 200 nm; Annealing; Heating; Orifices; Palladium; Plasma temperature; Substrates; Temperature sensors; annealing; nanorods; thermal plasma chemical vapor deposition; transparent nanocrystalline film; zinc oxide;
Conference_Titel :
Nano/Micro Engineered and Molecular Systems (NEMS), 2012 7th IEEE International Conference on
Conference_Location :
Kyoto
Print_ISBN :
978-1-4673-1122-9
DOI :
10.1109/NEMS.2012.6196770