Title :
Application of Back-side Alignment of Thick Layers for the Manufacturing of Advanced Power Devices
Author :
Lee, Jung Kil ; Chisholm, Rodney ; Van der Heijden, Mark ; Best, Keith ; Ten Berge, Peter
Author_Institution :
Fairchild Semicond. Korea, Gyeonggi
Abstract :
Back-side alignment was implemented in the thick layer process flow for the production of advanced power devices. The alignment and overlay performance of the back-side alignment scheme are addressed, as well as the benefits in terms of productivity and cost reduction
Keywords :
power semiconductor devices; semiconductor device manufacture; advanced power device manufacturing; back side alignment; cost reduction; overlay performance; productivity terms; Costs; Degradation; Manufacturing processes; Optical films; Production; Productivity; Semiconductor device manufacture; Silicon; Thick films; Voltage;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference, 2006. ASMC 2006. The 17th Annual SEMI/IEEE
Conference_Location :
Boston, MA
Print_ISBN :
1-4244-0254-9
DOI :
10.1109/ASMC.2006.1638732
