DocumentCode
2032554
Title
Application of Back-side Alignment of Thick Layers for the Manufacturing of Advanced Power Devices
Author
Lee, Jung Kil ; Chisholm, Rodney ; Van der Heijden, Mark ; Best, Keith ; Ten Berge, Peter
Author_Institution
Fairchild Semicond. Korea, Gyeonggi
fYear
2006
fDate
22-24 May 2006
Firstpage
104
Lastpage
107
Abstract
Back-side alignment was implemented in the thick layer process flow for the production of advanced power devices. The alignment and overlay performance of the back-side alignment scheme are addressed, as well as the benefits in terms of productivity and cost reduction
Keywords
power semiconductor devices; semiconductor device manufacture; advanced power device manufacturing; back side alignment; cost reduction; overlay performance; productivity terms; Costs; Degradation; Manufacturing processes; Optical films; Production; Productivity; Semiconductor device manufacture; Silicon; Thick films; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference, 2006. ASMC 2006. The 17th Annual SEMI/IEEE
Conference_Location
Boston, MA
ISSN
1078-8743
Print_ISBN
1-4244-0254-9
Type
conf
DOI
10.1109/ASMC.2006.1638732
Filename
1638732
Link To Document