Title :
Conductive micro silver wires via aerosol deposition
Author :
Xu, Bulei ; Lv, Wenlong ; Wang, Xiang ; Lei, Tingping ; Zheng, Gaofeng ; Zhao, Yang ; Sun, Daoheng
Author_Institution :
Dept. of Mech. & Electr. Eng., Xiamen Univ., Xiamen, China
Abstract :
A novel non-contact micro manufacturing technology of aerosol deposition is presented to fabricate conductive micro silver wires with width of several micrometers from silver inks. The ceramic nozzle with inner diameter of 250 μm is utilized to print the micro silver wires, the width of wires ranges from 15 μm to 70 μm and the thickness ranges from 200 nm to 2 μm. The printed silver wires are cured to decrease the resistance. High curing temperature and long curing time result in better conductivity of deposited wires due to the sufficient melt and combine of sliver particles. The minimum resistivity of 3.32 μΩ·cm is demonstrated for a continuous track cured at 300°C.
Keywords :
conducting materials; curing; electrical conductivity; electrical resistivity; silver; wires; Ag; aerosol deposition; ceramic nozzle; conductivity; curing; inks; noncontact micro manufacturing technology; printed conductive micro silver wires; resistance; resistivity; size 15 mum to 70 mum; size 200 nm to 2 mum; size 250 mum; temperature 300 degC; Conductivity; Nanoelectromechanical systems; Valves; Waste heat; Wires; aerosol deposition; resistivity; silver wires;
Conference_Titel :
Nano/Micro Engineered and Molecular Systems (NEMS), 2012 7th IEEE International Conference on
Conference_Location :
Kyoto
Print_ISBN :
978-1-4673-1122-9
DOI :
10.1109/NEMS.2012.6196775
