Conductive micro silver wires via aerosol deposition

Author

Xu, Bulei ; Lv, Wenlong ; Wang, Xiang ; Lei, Tingping ; Zheng, Gaofeng ; Zhao, Yang ; Sun, Daoheng

Author_Institution

Dept. of Mech. & Electr. Eng., Xiamen Univ., Xiamen, China

fYear

2012

fDate

5-8 March 2012

Firstpage

282

Lastpage

285

Abstract

A novel non-contact micro manufacturing technology of aerosol deposition is presented to fabricate conductive micro silver wires with width of several micrometers from silver inks. The ceramic nozzle with inner diameter of 250 μm is utilized to print the micro silver wires, the width of wires ranges from 15 μm to 70 μm and the thickness ranges from 200 nm to 2 μm. The printed silver wires are cured to decrease the resistance. High curing temperature and long curing time result in better conductivity of deposited wires due to the sufficient melt and combine of sliver particles. The minimum resistivity of 3.32 μΩ·cm is demonstrated for a continuous track cured at 300°C.

Keywords

conducting materials; curing; electrical conductivity; electrical resistivity; silver; wires; Ag; aerosol deposition; ceramic nozzle; conductivity; curing; inks; noncontact micro manufacturing technology; printed conductive micro silver wires; resistance; resistivity; size 15 mum to 70 mum; size 200 nm to 2 mum; size 250 mum; temperature 300 degC; Conductivity; Nanoelectromechanical systems; Valves; Waste heat; Wires; aerosol deposition; resistivity; silver wires;

fLanguage

English

Publisher

ieee

Conference_Titel

Nano/Micro Engineered and Molecular Systems (NEMS), 2012 7th IEEE International Conference on

Conference_Location

Kyoto

Print_ISBN

978-1-4673-1122-9

Type

conf

DOI

10.1109/NEMS.2012.6196775

Filename

6196775