DocumentCode :
2032683
Title :
Fabrication of nanogap electrode using electromigration method during metal deposition
Author :
Ohata, Takuma ; Naitoh, Y. ; Horikawa, M. ; Wang, Dong ; Maeda, Ryutaro
Author_Institution :
Micro Eng. & Micro Syst. Lab., Ibaraki Univ., Hitachi, Japan
fYear :
2012
fDate :
5-8 March 2012
Firstpage :
290
Lastpage :
293
Abstract :
In this paper, we suggest a new electormigration method to improve the previous electromigration method. The method is that electrical break-down is carried out during metal deposition for the fabrication of electrodes. As a result, the nanogap structure can be confirmed and break-down current showed lower magnitudes than the previous method. These result indicated possibility of applications to mass production of nanogap electrodes.
Keywords :
electric breakdown; electrochemical electrodes; electromigration; energy gap; gold; nanofabrication; nanostructured materials; Au-Si; Si; breakdown current; electrical breakdown; electromigration; gold deposition; nanogap electrode; nanogap structure; silicon substrate; Electrodes; Metals; Nanoelectromechanical systems; electromigration; nanogap;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nano/Micro Engineered and Molecular Systems (NEMS), 2012 7th IEEE International Conference on
Conference_Location :
Kyoto
Print_ISBN :
978-1-4673-1122-9
Type :
conf
DOI :
10.1109/NEMS.2012.6196777
Filename :
6196777
Link To Document :
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