DocumentCode
2032740
Title
Design and implementation of magnetically coupled current probe for monitoring simultaneous switching current in package
Author
Changhyun Cho ; Jonghyun Cho ; Kim, Jonghoon J. ; Joungho Kim ; Jun So Pak
Author_Institution
Dept. of Electr. Eng., KAIST, Daejeon, South Korea
fYear
2012
fDate
5-7 Dec. 2012
Firstpage
103
Lastpage
106
Abstract
In this paper, we present a new embedded current probe that can support measurement-based approach for extracting switching current waveform that was injected into power distribution network (PDN). The proposed embedded current probing structure utilizes magnetic coupling behavior between primary conducting via and secondary toroidal coil structure surrounding and it can be used as a sensor which relates the induced voltage across toroidal coil to the switching current of conducting via. This paper will present characterization of magnetic coupling behavior of proposed embedded current probing structure, demonstration of proposed current extraction method by implementing the current probing structure in a board level PDN and validation of SSN analysis by applying the extracted current waveform through the simulation and measurement result.
Keywords
coils; electronics packaging; probes; vias; PDN; SSN analysis; board level PDN; current extraction method; embedded current probing structure; magnetic coupling behavior; magnetically coupled current probe design; measurement-based approach; power distribution network; primary conducting via; secondary toroidal coil structure; sensor; simultaneous switching current monitoring; Conferences; Decision support systems; Electronics packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th
Conference_Location
Singapore
Print_ISBN
978-1-4673-4553-8
Electronic_ISBN
978-1-4673-4551-4
Type
conf
DOI
10.1109/EPTC.2012.6507060
Filename
6507060
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