High reliability and low cost in plastic PGA package with high performance

Author

Miwa, Takashi ; Otsuka, Kanji ; Shirai, Yuji ; Matsunaga, Toshihiro ; Tsuboi, Toshihiro

Author_Institution

Hitachi Ltd., Tokyo, Japan

fYear

1991

fDate

11-16 May 1991

Firstpage

183

Lastpage

189

Abstract

A 595-pin P-PGA (plastic-pin grid array package) was developed for a high-pin-count LSI. The reliability of the 595-pin P-PGA was investigated by means of temperature cycling, and moisture resistance and electromigration tests. The lifetime until 0.1% failure under temperature cycling is determined to be from 2500 to 2700 cycles. There was no failure in moisture resistance and electromigration tests. The electrical characteristics of 595-pin P-PGA were improved for a high-speed operation LSI. As a result, in addition to the fundamental design, a 595-pin P-PGA with eight metal layers was developed, which is suitable for a 50-MHz operation LSI under 3.3-V power supply

Keywords

circuit reliability; electromigration; failure analysis; large scale integration; packaging; electromigration; electromigration tests; failure; high-pin-count LSI; metal layers; moisture resistance; plastic PGA package; plastic-pin grid array package; reliability; temperature cycling; Costs; Electric resistance; Electric variables; Electromigration; Electronics packaging; Large scale integration; Moisture; Plastic packaging; Temperature; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1991. Proceedings., 41st

Conference_Location

Atlanta, GA

Print_ISBN

0-7803-0012-2

Type

conf

DOI

10.1109/ECTC.1991.163874

Filename

163874