Title :
Processing of 3D multilevel SU-8 fluidic network assisted by PerMX dry-photoresist lamination
Author :
Meier, R. Ch ; Badilita, V. ; Wallrabe, U. ; Korvink, J.G.
Author_Institution :
Dept. of Microsyst. Eng., Univ. of Freiburg, Freiburg, Germany
Abstract :
In this work we present a new manufacturing method for MEMS based multi-level microfluidic devices. The combination of spin-coating SU-8 (MicroChem) and lamination of PerMX dry-photoresist (DuPont) enables the fabrication of a complex 3-level microfluidic channel network with channel aspect ratios ranging from 0.3 up to 3. On 13 mm2 fluidic chip area we realized a complex 3D fluidic network by interconnecting three individual fluidic levels. The unique use of UV-photolithography tools and high-precision UV-lasering for the fluidic chip manufacturing results in 25 μm alignment accuracy between the fluidic levels. We further report on the high material compatibility of SU-8 and PerMX which results in high substrate adhesion of the fluidic devices (26.5 MPa).
Keywords :
laminations; microfluidics; photoresists; 3D multilevel SU-8 fluidic network; MEMS based multilevel microfluidic devices; PerMX dry-photoresist lamination; UV-photolithography tools; complex 3-level microfluidic channel network; fluidic chip manufacturing; high-precision UV-lasering; manufacturing method; spin-coating SU-8; Fabrication; Glass; Microfluidics; Resists; Substrates; dry-resist lamination; multi-level fluidic network;
Conference_Titel :
Nano/Micro Engineered and Molecular Systems (NEMS), 2012 7th IEEE International Conference on
Conference_Location :
Kyoto
Print_ISBN :
978-1-4673-1122-9
DOI :
10.1109/NEMS.2012.6196781
