DocumentCode
2032923
Title
Effect of working fluids on thermal characteristic of a closed-loop pulsating heat pipe heat exchanger: A case of three heat dissipating devices
Author
Kammuang-lue, N. ; Sakulchangsatjatai, P. ; Terdtoon, P.
Author_Institution
Dept. of Mech. Eng., Chiang Mai Univ., Chiang Mai, Thailand
fYear
2012
fDate
5-7 Dec. 2012
Firstpage
142
Lastpage
147
Abstract
The closed-loop pulsating heat pipe (CLPHP) is a heat exchanger with a very high thermal conductivity. A single CLPHP is frequently used to release the heat between one heat dissipating device and one heat sink. However, some electrical applications have a number of heat dissipating devices. The CLPHP is applied to transfer the heat from multiple devices. Since the CLPHP primarily transfers the heat by means of working fluid´s phase change, the thermal characteristic of the CLPHP significantly depends on the working fluid type. In order to be the fundamental information for heat exchanger manufacturers, this study on effect of working fluids has been performed. Three electrical plate heaters were installed to the CLPHP as the heat dissipating devices. Experiments were conducted by varying the working fluid which was R123, ethanol and water. For each working fluid, the input heat fluxes of heat dissipating devices were also varied within 6 different patterns. It can be concluded that when the latent heat of evaporation increases - in a case of the vertical CLPHP, and when the dynamic viscosity of liquid increases - in a case of the horizontal CLPHP, the thermal resistance increases and the thermal performance consequently decreases.
Keywords
closed loop systems; cooling; fluids; heat exchangers; heat pipes; thermal conductivity; viscosity; CLPHP; R123; closed-loop pulsating heat pipe; closed-loop pulsating heat pipe heat exchanger; dynamic liquid viscosity; electrical plate heaters; electronic device cooling; ethanol; fundamental information; heat dissipating devices; heat exchanger manufacturers; heat fluxes; heat sink; heat transfer; high thermal conductivity; latent heat of evaporation; thermal characteristics; thermal performance; thermal resistance; working fluid phase change; Fluids; Heat sinks; Heat transfer; Resistance heating; Thermal resistance; closed-loop pulsating heat pipe; electronic device cooling; heat exchanger; multiple heat dissipating devices; thermal characteristic;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th
Conference_Location
Singapore
Print_ISBN
978-1-4673-4553-8
Electronic_ISBN
978-1-4673-4551-4
Type
conf
DOI
10.1109/EPTC.2012.6507067
Filename
6507067
Link To Document