Title :
Electrical packaging impact on source components in optical interconnects
Author :
Neifeld, M.A. ; Chou, Wu Cbun
Author_Institution :
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
Abstract :
A simulation study of optical interconnects is described. Influences of electrical packaging technologies on laser source performance is evaluated. Various laser and driver types are considered together with ceramic board, film carrier and flip-chip connections
Keywords :
optical interconnections; ceramic board; driver types; electrical packaging technologies; film carrier; flip-chip connections; laser source; optical interconnects; simulation study; source components; Diode lasers; Driver circuits; Optical crosstalk; Optical fiber communication; Optical interconnections; Optical modulation; Optical noise; Optical receivers; Packaging; Semiconductor laser arrays;
Conference_Titel :
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-2411-0
DOI :
10.1109/EPEP.1994.594157
