Four multi probing test for 16 bit DAC with vertical contact probe card

Author

Sasho, Seiji ; Sakata, Teruhisa

Author_Institution

Asahi Kasei Microsyst. Co., Nobeoka, Japan

fYear

1996

fDate

20-25 Oct 1996

Firstpage

86

Lastpage

91

Abstract

Assuring full electrical performance of known good die is a continuous issue for semiconductor manufacturers. On the other hand, reducing test costs is also a constant issue for semiconductor manufacturers. This paper describes a method to satisfy both needs on a mixed-signal device by multi-die probing. 4-die probing for 16 bit Δ Σ DAC was attempted using the HP9490 mixed-signal LSI test system and a vertical contact probe card. A comparison of analog characteristics between wafer probing and final test, yield, and test throughput is discussed

Keywords

automatic test equipment; automatic testing; circuit optimisation; digital-analogue conversion; economics; integrated circuit testing; integrated circuit yield; large scale integration; mixed analogue-digital integrated circuits; production testing; semiconductor device manufacture; semiconductor device testing; 16 bit DAC; HP9490 mixed-signal LSI test; analog characteristics; crosstalk; efficiency; electrical performance; mixed-signal LSI test; mixed-signal device; multi probing test; multi-die probing; semiconductor manufacturers; test costs; test throughput; throughput; vertical contact probe card; wafer probing; yield; Biomembranes; Contacts; Costs; Electric variables; Noise reduction; Probes; Semiconductor device manufacture; Semiconductor device testing; System testing; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Test Conference, 1996. Proceedings., International

Conference_Location

Washington, DC

ISSN

1089-3539

Print_ISBN

0-7803-3541-4

Type

conf

DOI

10.1109/TEST.1996.556948

Filename

556948