• DocumentCode
    2033169
  • Title

    Brightfield iADC Applications for Yield Learning and Excursion Monitoring

  • Author

    Wittenzellner, John

  • Author_Institution
    Micron Technol., Inc., Manassas, VA
  • fYear
    2006
  • fDate
    22-24 May 2006
  • Firstpage
    202
  • Lastpage
    207
  • Abstract
    Inline ADC provides classification data for all detected wafer defects at run time, without having a negative impact on tool throughput. MTV has successfully used iADC to monitor excursions as well as predict probe fails using inline inspections. The use of iADC has reduced MTV´s reliance on SEM review and allowed for more consistent disposition of process issues on the production floor. While iADC is not a standalone solution to yield improvement, it does provide another powerful tool for the defect engineer
  • Keywords
    inspection; integrated circuit yield; production testing; scanning electron microscopy; brightfield iADC; classification data; excursion monitoring; inline ADC; inline automatic defect classification; inline inspections; yield learning; Costs; Fabrication; Focusing; Inspection; Light scattering; Monitoring; Pixel; Production; Safety; Stability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference, 2006. ASMC 2006. The 17th Annual SEMI/IEEE
  • Conference_Location
    Boston, MA
  • ISSN
    1078-8743
  • Print_ISBN
    1-4244-0254-9
  • Type

    conf

  • DOI
    10.1109/ASMC.2006.1638752
  • Filename
    1638752