DocumentCode
2033169
Title
Brightfield iADC Applications for Yield Learning and Excursion Monitoring
Author
Wittenzellner, John
Author_Institution
Micron Technol., Inc., Manassas, VA
fYear
2006
fDate
22-24 May 2006
Firstpage
202
Lastpage
207
Abstract
Inline ADC provides classification data for all detected wafer defects at run time, without having a negative impact on tool throughput. MTV has successfully used iADC to monitor excursions as well as predict probe fails using inline inspections. The use of iADC has reduced MTV´s reliance on SEM review and allowed for more consistent disposition of process issues on the production floor. While iADC is not a standalone solution to yield improvement, it does provide another powerful tool for the defect engineer
Keywords
inspection; integrated circuit yield; production testing; scanning electron microscopy; brightfield iADC; classification data; excursion monitoring; inline ADC; inline automatic defect classification; inline inspections; yield learning; Costs; Fabrication; Focusing; Inspection; Light scattering; Monitoring; Pixel; Production; Safety; Stability;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference, 2006. ASMC 2006. The 17th Annual SEMI/IEEE
Conference_Location
Boston, MA
ISSN
1078-8743
Print_ISBN
1-4244-0254-9
Type
conf
DOI
10.1109/ASMC.2006.1638752
Filename
1638752
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