Title :
Clean Dicing of Compound Semiconductors Using the Water-Jet Guided Laser Technology
Author :
Perrottet, Delphine ; Green, Sean ; Richerzhagen, Bernold
Author_Institution :
Synova SA, Ecublens
Abstract :
The water-jet-guided laser is a new technology for micro machining that combines a laser beam into a hair-thin, low-pressure water jet for wafer dicing. In addition to silicon, it can dice compound semiconductors such as GaAs, InP and SiC without damage
Keywords :
laser beam cutting; micromachining; water jet cutting; clean dicing; compound semiconductors; low-pressure water jet; micromachining; wafer dicing; water-jet guided laser; Abrasives; Contamination; Gallium arsenide; Laser beam cutting; Optical materials; Semiconductor lasers; Semiconductor materials; Surface emitting lasers; Water jet cutting; Water pollution;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference, 2006. ASMC 2006. The 17th Annual SEMI/IEEE
Conference_Location :
Boston, MA
Print_ISBN :
1-4244-0254-9
DOI :
10.1109/ASMC.2006.1638759
