Title :
Enabling Facility Re-Use for 300mm Semiconductor Manufacturing via Integration of Automated Material Handling System and Facility Design
Author :
Seall, Steve ; Steele, Douglas C. ; Jung, Melvin
Author_Institution :
Intel Corp., Chandler, AZ
Abstract :
This paper describes issues faced by Intel during planning for its first conversion of an existing high volume 200mm semiconductor factory to manufacturing on 300mm wafers. A summary of the constraints and challenges, analysis of alternatives, and description of the adopted solution for modifying AMHS and facility design to allow re-use of an existing 200mm semiconductor fab for manufacturing semiconductors on 300mm wafers is discussed
Keywords :
electronics industry; facilities planning; materials handling; production facilities; 300 mm; automated material handling system; facility design; semiconductor factory; semiconductor manufacturing; wafers; Floors; Manufacturing automation; Material storage; Materials handling; Production facilities; Pulp manufacturing; Semiconductor device manufacture; Semiconductor materials; Storage automation; Throughput;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference, 2006. ASMC 2006. The 17th Annual SEMI/IEEE
Conference_Location :
Boston, MA
Print_ISBN :
1-4244-0254-9
DOI :
10.1109/ASMC.2006.1638764
