• DocumentCode
    2033676
  • Title

    A piezoresistive normal and shear force sensor using liquid metal alloy as gauge material

  • Author

    Xiaomei Shi ; Cheng, Ching-Hsiang ; Chao, Chen ; Wang, Like ; Zheng, Yongping

  • Author_Institution
    Dept. of Ind. & Syst. Eng., Hong Kong Polytech. Univ., Hong Kong, China
  • fYear
    2012
  • fDate
    5-8 March 2012
  • Firstpage
    483
  • Lastpage
    486
  • Abstract
    We present a novel normal and shear force sensor by using liquid metal alloy (Ga-In-Sn) as piezoresistive gauge material encapsulated in a polydimethylsiloxane (PDMS) substrate. By using liquid metal alloy as gauge material, it can detect large forces without breaking the sensor wires. Since the liquid-metal piezoresistors deform with the elastomeric substrate, shear and normal forces can be detected with resistance changes of the piezoresistors. Each force sensor comprises a pair of symmetric piezoresistors, which is screen-printed on the cavity of PDMS substrate with tilt angle around 30° to be sensitive to both normal and shear forces. Normal force will compress both piezoresistors as common mode while shear force will shorten one piezoresistor but elongate the other as differential mode. The testing results demonstrate the sensitivity of the force sensor in both normal and shear directions. The hysteresis of the force sensor was also measured.
  • Keywords
    force sensors; gallium alloys; indium alloys; liquid alloys; piezoresistive devices; resistors; tin alloys; GaInSn; PDMS substrate; elastomeric substrate; gauge material; liquid metal alloy; liquid-metal piezoresistors; piezoresistive normal sensor; polydimethylsiloxane substrate; sensor wires; shear force sensor; symmetric piezoresistors; Biomechanics; Biomedical monitoring; Displacement measurement; Force measurement; Irrigation; Materials; Monitoring; PDMS; liquid metal; normal and shear force sensor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems (NEMS), 2012 7th IEEE International Conference on
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-1-4673-1122-9
  • Type

    conf

  • DOI
    10.1109/NEMS.2012.6196822
  • Filename
    6196822