Title :
Die bonding in embedded substrates
Author :
Oppermann, H. ; Rothermund, M. ; Jurgensen, Nils ; Yen, U. ; Essig, K.
Author_Institution :
Fraunhofer IZM, Berlin, Germany
Abstract :
In advanced packaging processes the chips are molded after placement and the chip bonding pads need to be opened by laser drilling. In order to avoid post bond measurements and any correction of individual drilling location it is important to establish a process of high precision die bonding. We investigated the die bonding of 50 μm thin silicon chips on Cu leadframe using thin layers of Au/Sn solder and studied the assembly with respect to solder joint formation, metallurgy, mechanical strength and finally the post bond accuracy achieved.
Keywords :
copper; electronics packaging; gold alloys; laser beam machining; microassembling; silicon; solders; tin alloys; advanced packaging processes; chip bonding pads; die bonding; embedded substrates; high precision die bonding process; individual drilling location; laser drilling; mechanical strength; metallurgy; post bond measurement avoidance; solder joint formation; solder thin layers; thin silicon chips; Accuracy; Bonding; Gold; Lead; Microassembly; Semiconductor device measurement; Tin;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th
Conference_Location :
Singapore
Print_ISBN :
978-1-4673-4553-8
Electronic_ISBN :
978-1-4673-4551-4
DOI :
10.1109/EPTC.2012.6507095
