Optimization of temporary bonding through high-resolution metrologies to realize ultrathin wafer handling

Author

Lee, Albert ; Su, Jianhui ; McCutcheon, Jeremy ; Wang, Bor Kai ; Tsai, Leon ; Shorey, Aric

Author_Institution

Brewer Sci. Taiwan/Brewer Sci., Inc., Taipei, Taiwan

fYear

2012

fDate

5-7 Dec. 2012

Firstpage

322

Lastpage

325

Abstract

Interest has intensified in temporary wafer bonding technology for thin wafer handling to realize 3D system integration. Several challenges such as thermal stability, process compatibility, and chemical resistance for temporary adhesives have been addressed in numerous publications. However, the correlation of thickness variation among carrier, temporary adhesive, temporary bonding, and final thinning thickness is rarely discussed because of limitations in metrology. The work described here utilized a WaferBOND^® advanced bonding material and ZoneBOND^® [1] technology from Brewer Science, Inc., as well as the Tropel^® FlatMaster^® MSP-300 and semiconductor glass wafers from Corning Incorporated to evaluate the influence of each layer and suitable metrology to enhance overall performance.

Keywords

adhesive bonding; optimisation; wafer bonding; 3D system integration; MSP-300; WaferBOND advanced bonding material; ZoneBOND technology; final thinning thickness; high-resolution metrologies; realize ultrathin wafer handling; semiconductor glass wafers; temporary adhesives; temporary bonding; temporary wafer bonding technology optimization; thickness variation correlation; thin wafer handling; Bonding; Correlation; Glass; Semiconductor device measurement; Silicon; Thickness measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th

Conference_Location

Singapore

Print_ISBN

978-1-4673-4553-8

Electronic_ISBN

978-1-4673-4551-4

Type

conf

DOI

10.1109/EPTC.2012.6507100

Filename

6507100