Optimization of temporary bonding through high-resolution metrologies to realize ultrathin wafer handling

Interest has intensified in temporary wafer bonding technology for thin wafer handling to realize 3D system integration. Several challenges such as thermal stability, process compatibility, and chemical resistance for temporary adhesives have been addressed in numerous publications. However, the correlation of thickness variation among carrier, temporary adhesive, temporary bonding, and final thinning thickness is rarely discussed because of limitations in metrology. The work described here utilized a WaferBOND^® advanced bonding material and ZoneBOND^® [1] technology from Brewer Science, Inc., as well as the Tropel^® FlatMaster^® MSP-300 and semiconductor glass wafers from Corning Incorporated to evaluate the influence of each layer and suitable metrology to enhance overall performance.