• DocumentCode
    2034194
  • Title

    A wide frequency band characterization technique for multiple-terminal discrete decoupling capacitors

  • Author

    Hui-Ying Ng ; Wui-Weng Wong

  • Author_Institution
    Adv. Micro Devices (Singapore) Pte Ltd., Singapore, Singapore
  • fYear
    2012
  • fDate
    5-7 Dec. 2012
  • Firstpage
    389
  • Lastpage
    392
  • Abstract
    This paper describes an effective characterization method developed for frequency-dependent electrical characteristics of multiple-terminal chip capacitors used widely in power delivery networks in today´s high-speed digital applications. This technique achieves excellent accuracy across a wide frequency range in the chip capacitor application on a digital ASIC substrate compared to conventional ESR and ESL extraction methods. To ensure the developed circuit models cover the wide frequency range, multiple branches of RLC elements are proposed to capture the higher-order frequency response of the chip capacitor impedance. The characterization procedure consists of carefully designed test fixtures, two-port VNA measurements, a de-embedding process, and circuit modeling and simulation. Simulation results demonstrated using this method is further correlated with a frequency limited de-embedded s-parameters from measurements.
  • Keywords
    S-parameters; application specific integrated circuits; capacitors; frequency response; integrated circuit modelling; network analysers; ESL extraction; ESR extraction; RLC elements; chip capacitor impedance; circuit modeling; deembedding process; digital ASIC substrate; equivalent series inductance; equivalent series resistance; higher-order frequency response; multiple-terminal chip capacitors; multiple-terminal discrete decoupling capacitors; power delivery networks; s-parameters; two-port VNA measurements; wide frequency band characterization technique; Conferences; Decision support systems; Electronics packaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4673-4553-8
  • Electronic_ISBN
    978-1-4673-4551-4
  • Type

    conf

  • DOI
    10.1109/EPTC.2012.6507113
  • Filename
    6507113