Title :
Study on low-cost QFN packages for high-frequency applications
Author :
Boyu Zheng ; Cubillo, Joseph Romen ; Katti, Guruprasad ; Cheng Jin ; Rajoo, Ranjan ; Kai Chong Chan
Author_Institution :
Inst. of Microelectron., A*STAR (Agency for Sci., Technol. & Res.), Singapore, Singapore
Abstract :
Quad flat no-lead (QFN) packages have found wide applications in RF and high-speed digital systems. The purpose of this paper is to study high-frequency performance of conventional low-cost QFN packages, and the impact of various parameters. Physical insight of the bond wires and leadframe are presented through full-wave simulation study. Critical parameters are identified and their effects are evaluated at frequencies up to 20 GHz.
Keywords :
digital integrated circuits; lead bonding; packaging; parameter estimation; radiofrequency integrated circuits; RF digital systems; bond wires; full-wave simulation; high-speed digital systems; leadframe; parameter identification; quad flat no-lead packages; Compounds; Dielectric losses; Impedance; Inductance; Insertion loss; Integrated circuit modeling; Wires;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th
Conference_Location :
Singapore
Print_ISBN :
978-1-4673-4553-8
Electronic_ISBN :
978-1-4673-4551-4
DOI :
10.1109/EPTC.2012.6507116
