DocumentCode
2034259
Title
Study on low-cost QFN packages for high-frequency applications
Author
Boyu Zheng ; Cubillo, Joseph Romen ; Katti, Guruprasad ; Cheng Jin ; Rajoo, Ranjan ; Kai Chong Chan
Author_Institution
Inst. of Microelectron., A*STAR (Agency for Sci., Technol. & Res.), Singapore, Singapore
fYear
2012
fDate
5-7 Dec. 2012
Firstpage
401
Lastpage
406
Abstract
Quad flat no-lead (QFN) packages have found wide applications in RF and high-speed digital systems. The purpose of this paper is to study high-frequency performance of conventional low-cost QFN packages, and the impact of various parameters. Physical insight of the bond wires and leadframe are presented through full-wave simulation study. Critical parameters are identified and their effects are evaluated at frequencies up to 20 GHz.
Keywords
digital integrated circuits; lead bonding; packaging; parameter estimation; radiofrequency integrated circuits; RF digital systems; bond wires; full-wave simulation; high-speed digital systems; leadframe; parameter identification; quad flat no-lead packages; Compounds; Dielectric losses; Impedance; Inductance; Insertion loss; Integrated circuit modeling; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th
Conference_Location
Singapore
Print_ISBN
978-1-4673-4553-8
Electronic_ISBN
978-1-4673-4551-4
Type
conf
DOI
10.1109/EPTC.2012.6507116
Filename
6507116
Link To Document