Title :
Fabrication and analysis of integrated MEMS pyramidal horn antenna for terahertz applications
Author :
Li, Cong ; Guo, Lisheng ; Wu, W.G. ; Tang, Xiaowu Shirley ; Huang, F.Y.
Author_Institution :
Nat. Key Lab. of Sci. & Technol. on Micro/Nano Fabrication, Peking Univ., Beijing, China
Abstract :
This paper reports the fabrication and analysis of a back-to-back pyramidal horn antenna based on Micro-electromechanical Systems (MEMS) technology, which is used in terahertz (THz) applications. This method is able to manufacture antenna with various geometrical configuration embedded in Si substrates. The dimensional tolerance of this technique is determined by the lithography process, which could be controlled down to tens nm. Therefore, this technique is controllable and of high precision and quality. The performance of fabricated antenna device was verified by Ansoft High Frequency Structure Simulator (HFSS) simulation. The result shows that the antenna gain ranges from 10-15dB, and voltage standing wave ratio (VSWR) is less than 2 in the frequency band of 3.25-3.55THz.
Keywords :
horn antennas; lithography; micromechanical devices; monolithic integrated circuits; submillimetre wave antennas; substrates; Ansoft high frequency structure simulator; HFSS simulation; MEMS technology; Si substrates; VSWR; antenna gain; antenna manufacture; back-to-back pyramidal horn antenna analysis; back-to-back pyramidal horn antenna fabrication; frequency 3.25 THz to 3.55 THz; gain 10 dB to 15 dB; geometrical configuration; integrated MEMS pyramidal horn antenna analysis; integrated MEMS pyramidal horn antenna fabrication; lithography process; micro-electromechanical systems; terahertz applications; voltage standing wave ratio; Copper; Horn antennas; Micromechanical devices; Resists; Horn Antenna; KOH etching; MEMS; THz;
Conference_Titel :
Nano/Micro Engineered and Molecular Systems (NEMS), 2012 7th IEEE International Conference on
Conference_Location :
Kyoto
Print_ISBN :
978-1-4673-1122-9
DOI :
10.1109/NEMS.2012.6196850
