Title :
Chip-package interaction: Challenges and solutions to mechanical stability of Back end of Line at 28nm node and beyond for advanced flip chip application
Author :
Kuechenmeister, F. ; Breuer, Dirk ; Geisler, H. ; Paul, J. ; Shah, Chirag ; Machani, K.V. ; Kosgalwies, S. ; Agarwal, Rohit ; Gao, Smith
Author_Institution :
Global Foundries Inc., Dresden, Germany
Abstract :
Fhis paper discusses the extensive development work carried out by GLOBALFOUNDRIES to mitigate chip-package interaction (CPI) risks for the silicon Backend of Line (BEOL) during IC package assembly. Particularly, material property data for different ultra low k (ULK) materials, CPI qualification results and key findings made during the technology development are discussed. Newly developed test and modeling methods to expedite technology learning are also described in detail.
Keywords :
flip-chip devices; integrated circuit packaging; mechanical stability; advanced flip chip application; back end of line; chip-package interaction; integrated circuit package assembly; material property; mechanical stability; size 28 nm; ultra low k material; Conferences; Decision support systems; Electronics packaging;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th
Conference_Location :
Singapore
Print_ISBN :
978-1-4673-4553-8
Electronic_ISBN :
978-1-4673-4551-4
DOI :
10.1109/EPTC.2012.6507122
