Title :
I/O options for MCNC multichip package
Author :
Koopman, Nicholas G.
Author_Institution :
MCNC Center for Microelectron., Research Triangle Park, NC, USA
Abstract :
A strategy for signal and power connections to the MCNC multichip module is formulated. The module structure is described in detail. System trends and scaling theory are used to define requirements for three generations of multichip module technology extending to the year 2000. The state of the art of computer manufacturers and development activities of connector vendors is discussed. Pin, pinless, and flexible circuit technologies are described, with specific combinations of technologies being fitted to the MCNC substrate. The intent is to generate a menu of compatible technologies and applications
Keywords :
hybrid integrated circuits; packaging; MCNC multichip package; compatible technologies; flexible circuit technologies; multichip module; power connections; scaling theory; signal connections; Aging; Computer aided manufacturing; Cooling; Costs; Integrated circuit interconnections; Integrated circuit technology; Microelectronics; Multichip modules; National electric code; Packaging;
Conference_Titel :
Electronic Components and Technology Conference, 1991. Proceedings., 41st
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-0012-2
DOI :
10.1109/ECTC.1991.163882
