Title :
Interconnect series impedance determination using a surface ribbon method
Author :
Tuncer, Emre ; Lee, Beom-Taek ; Neikirk, Dean P.
Author_Institution :
Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
Abstract :
In this paper we apply the current filament method to surface “ribbons” instead of volume filaments, leading to a substantial reduction in problem size and increase in computational efficiency. The accuracy is excellent when compared to “full Weeks” calculations, with a factor of almost 100 reduction in CPU time
Keywords :
multichip modules; CPU time; MCMs; computational efficiency; current filament method; interconnect series impedance determination; problem size; surface ribbon method; Computational efficiency; Conductors; Conformal mapping; Current density; Current distribution; Frequency; Magnetic fields; Slabs; Surface fitting; Surface impedance;
Conference_Titel :
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-2411-0
DOI :
10.1109/EPEP.1994.594163
