DocumentCode
2034756
Title
Wafer positioning by laser scanning method
Author
Lee, Ju-Yi ; Chen, Yi-Cheng ; Chen, Jian-You ; Lee, Yun-Yan ; Chen, Yu-Bin
Author_Institution
Dept. of Mech. Eng., Nat. Central Univ., Chungli, Taiwan
fYear
2011
fDate
13-18 Sept. 2011
Firstpage
1833
Lastpage
1837
Abstract
A laser scanning method for wafer positioning is proposed. This wafer positioning method incorporates a laser scanner system and a scattering light receiving system. The scanner is used to reflect a laser beam into a scanning line on the sensing area. As the wafer passes by the scanning line, a scattering light receiving system detects the time-sequence signal of the scattered lights. The position of wafer relative to the robot plate is determined by signal processing of the time-sequence signal. The measurement precision is about 0.3 mm.
Keywords
optical scanners; position control; production engineering computing; robotic assembly; semiconductor device manufacture; signal processing; laser scanning method; robot plate; scattering light receiving system; signal processing; time sequence signal detection; wafer positioning; Laser beams; Measurement by laser beam; Position measurement; Robot kinematics; Robot sensing systems; Uncertainty; Laser scanning; Wafer positioning;
fLanguage
English
Publisher
ieee
Conference_Titel
SICE Annual Conference (SICE), 2011 Proceedings of
Conference_Location
Tokyo
ISSN
pending
Print_ISBN
978-1-4577-0714-8
Type
conf
Filename
6060264
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