DocumentCode :
2034930
Title :
A multipath AODV routing protocol in mobile ad hoc networks with SINR-based route selection
Author :
Park, Jiwon ; Moh, Sangman ; Chung, Ilyong
Author_Institution :
Sch. of Comput. Eng., Chosun Univ., Gwangju, South Korea
fYear :
2008
fDate :
21-24 Oct. 2008
Firstpage :
682
Lastpage :
686
Abstract :
This paper proposes a multipath routing protocol called cross-layered multipath AODV (CM-AODV), which selects multiple routes on demand based on the signal-to-interference plus noise ratio (SINR) measured at the physical layer. Note that AODV (ad hoc on-demand distance vector) is one of the most popular routing protocols for mobile ad hoc networks. Each time a route request (RREQ) message is forwarded hop by hop, each forwarding node updates the route quality which is defined as the minimum SINR of serialized links in a route and contained in the RREQ header. Compared to the conventional multipath version of AODV protocol (which is called AOMDV), CM-AODV assigns the construction of multiple paths to the destination node and makes it algorithmically simple, resulting in the improved performance of packet delivery and the less overhead incurred at intermediate nodes. Our performance study shows that CMAODV significantly outperforms AOMDV in terms of packet delivery ratio and average end-to-end delay, but results in up to 45 percent less routing overhead.
Keywords :
ad hoc networks; mobile radio; multipath channels; routing protocols; SINR-based route selection; ad hoc on-demand distance vecto; average end-to-end delay; cross-layered multipath AODV; destination node; mobile ad hoc networks; multipath routing protocol; packet delivery; packet delivery ratio; route quality; route request message; signal-to-interference plus noise ratio; Computer networks; Cross layer design; Delay; Mobile ad hoc networks; Noise measurement; Physical layer; Physics computing; Robustness; Routing protocols; Signal to noise ratio;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Wireless Communication Systems. 2008. ISWCS '08. IEEE International Symposium on
Conference_Location :
Reykjavik
Print_ISBN :
978-1-4244-2488-7
Electronic_ISBN :
978-1-4244-2489-4
Type :
conf
DOI :
10.1109/ISWCS.2008.4726143
Filename :
4726143
Link To Document :
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