Title :
Interconnection method of liquid crystal driver LSIs by TAB-on-glass and board to glass using anisotropic conductive film and monosotropic heat seal connectors
Author :
Reinke, Roger R.
Author_Institution :
Elform Inc., Reno, NV, USA
Abstract :
Tape automated bonding (TAB) on glass (TOG) was developed as a way to package high-resolution LCDs (liquid crystal displays) in mass production. This technology bonds the tape carrier LC driver LSIs directly onto one side of an LCD panel using anisotropic conductive film. To the adjacent side of the LCD panel, flexible circuit monosotropic heat seal connectors (HSCs) are used to interconnect the LSIs to the glass and can be used to interconnect to the PWB (printed wiring board). TOG is the chosen method for attaching TAB to glass, and the HSCs are widely used for attaching TAB to glass, TAB to PWBs, and glass to rigid PWBs. The HSCs have been successful in driving multiplex-addressed multicolor LCDs whose effective viewing area is 8 in×8 in and smaller displays in mass production. The large panel requires 640 terminations to each side of the glass panel and to four row and column PWBs for a total of 5120 terminations on a pitch of 0.011 in
Keywords :
driver circuits; electric connectors; large scale integration; liquid crystal displays; packaging; printed circuit manufacture; tape automated bonding; LCD panel; TAB-on-glass; anisotropic conductive film; board to glass interconnection; driver LSI; flexible circuit; high-resolution LCDs; liquid crystal displays; liquid crystal driver; mass production; microassembly; monosotropic heat seal connectors; multiplex-addressed multicolor LCDs; package; printed wiring board; tape carrier; Anisotropic conductive films; Bonding; Driver circuits; Glass; Integrated circuit interconnections; Joining processes; Liquid crystal displays; Liquid crystals; Mass production; Packaging;
Conference_Titel :
Electronic Components and Technology Conference, 1991. Proceedings., 41st
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-0012-2
DOI :
10.1109/ECTC.1991.163900