• DocumentCode
    2035029
  • Title

    RF performance of inkjet and stencil printed traces for flexible electronics applications

  • Author

    Ying Ying Lim ; Yee Mey Goh ; Changqing Liu

  • Author_Institution
    Wolfson Sch. of Mech. & Manuf. Eng., Loughborough Univ., Loughborough, UK
  • fYear
    2012
  • fDate
    5-7 Dec. 2012
  • Firstpage
    556
  • Lastpage
    562
  • Abstract
    Interest in body area networks (BAN) operating in the millimeter-wave regime (60 GHz) is increasing due to concerns over the security of data transfer. Obtaining low loss in the higher frequencies is important for high performance interconnects. In this paper, two materials deposition techniques - inkjet printing and stencil printing are being investigated for creating conductive traces on fabrics to enable high frequency (up to 20 GHz) applications. In the inkjet printing, various surface treatments were considered and utilized to improve the ink-substrate interaction for the enhancement of adhesion of the deposited structures. Finally the RF losses of printed microstrip lines using the above techniques were analyzed, compared against the copper traces which are conventionally achieved by etching process.
  • Keywords
    adhesion; body area networks; flexible electronics; ink jet printing; microstrip lines; millimetre wave devices; surface treatment; BAN; adhesion; body area networks; data transfer; flexible electronics applications; frequency 60 GHz; inkjet printing; millimeter-wave regime; printed microstrip lines; stencil printed traces; stencil printing; surface treatments; Conductivity; Ink; Metals; Printing; Resistance; Substrates; Surface treatment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4673-4553-8
  • Electronic_ISBN
    978-1-4673-4551-4
  • Type

    conf

  • DOI
    10.1109/EPTC.2012.6507144
  • Filename
    6507144