DocumentCode
2035029
Title
RF performance of inkjet and stencil printed traces for flexible electronics applications
Author
Ying Ying Lim ; Yee Mey Goh ; Changqing Liu
Author_Institution
Wolfson Sch. of Mech. & Manuf. Eng., Loughborough Univ., Loughborough, UK
fYear
2012
fDate
5-7 Dec. 2012
Firstpage
556
Lastpage
562
Abstract
Interest in body area networks (BAN) operating in the millimeter-wave regime (60 GHz) is increasing due to concerns over the security of data transfer. Obtaining low loss in the higher frequencies is important for high performance interconnects. In this paper, two materials deposition techniques - inkjet printing and stencil printing are being investigated for creating conductive traces on fabrics to enable high frequency (up to 20 GHz) applications. In the inkjet printing, various surface treatments were considered and utilized to improve the ink-substrate interaction for the enhancement of adhesion of the deposited structures. Finally the RF losses of printed microstrip lines using the above techniques were analyzed, compared against the copper traces which are conventionally achieved by etching process.
Keywords
adhesion; body area networks; flexible electronics; ink jet printing; microstrip lines; millimetre wave devices; surface treatment; BAN; adhesion; body area networks; data transfer; flexible electronics applications; frequency 60 GHz; inkjet printing; millimeter-wave regime; printed microstrip lines; stencil printed traces; stencil printing; surface treatments; Conductivity; Ink; Metals; Printing; Resistance; Substrates; Surface treatment;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th
Conference_Location
Singapore
Print_ISBN
978-1-4673-4553-8
Electronic_ISBN
978-1-4673-4551-4
Type
conf
DOI
10.1109/EPTC.2012.6507144
Filename
6507144
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