DocumentCode :
2035044
Title :
Improvement of electrical, mechanical and surface properties of silicone insulators
Author :
Ehsani, M. ; Borsi, H. ; Gockenbach, E. ; Bakhshandeh, G.R. ; Morshedian, J.
Author_Institution :
Iran Polymer & Petrochem. Inst., Tehran, Iran
fYear :
2004
fDate :
17-20 Oct. 2004
Firstpage :
623
Lastpage :
626
Abstract :
The present paper reports the results of a study of mechanical and electrical properties of polymeric insulators. Silicone rubber (SIR), ethylene-propylene-diene monomer (EPDM) and alloys of silicone-EPDM are known polymers for use as high voltage insulators. The result of mechanical measurement shows that the tensile strength, modulus and elongation of blends is enhanced with increase of SIR in the formulation. It can be seen from the results of dielectric behavior measurement that the dissipation factor tan δ and capacity of silicone rubber was improved by the effects of EPDM in blends. The blends of silicone-EPDM show good dielectric behavior compare to silicone rubber at humidity ambient. The new alloy presents excellent dielectric properties in water and humidity ambient in comparison to existing EPDM, silicone and their blends.
Keywords :
Young´s modulus; dielectric properties; polymer blends; polymer insulators; silicone rubber insulators; tensile strength; SIR blends; ambient humidity; dielectric measurement; dissipation factor; electrical properties; elongation; ethylene-propylene-diene monomer; high voltage insulators; mechanical properties; modulus; outdoor insulators; polymeric insulators; silicone insulators; silicone rubber capacity; silicone-EPDM alloys; surface properties; tensile strength; Dielectric measurements; Dielectrics and electrical insulation; Humidity; Mechanical factors; Mechanical variables measurement; Plastic insulation; Polymers; Rubber; Silicon alloys; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 2004. CEIDP '04. 2004 Annual Report Conference on
Print_ISBN :
0-7803-8584-5
Type :
conf
DOI :
10.1109/CEIDP.2004.1364327
Filename :
1364327
Link To Document :
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