DocumentCode
2035155
Title
Technological and architectural power optimizations for advance microprocessors
Author
Lichtenau, Cédric ; Ortiz, Alberto Garcia ; Pflüger, Thomas
Author_Institution
IBM Deutschland, Boeblingen, Germany
Volume
1
fYear
2005
fDate
14-15 July 2005
Firstpage
11
Abstract
Reliability, thermal management, packaging cost, and suitability for mobile devices, are making power consumption a main concern for high-end microprocessors. In order to tackle this problem, power efficient design techniques addressing all the abstraction levels are required. To satisfy the demands of increasing functionality and higher processing power, the design of high-end microprocessor must face two main challenges. On the one hand, it must be implemented in highly compact nanoscaled technologies. On the other hand, it must handle the increased design complexity, especially from a power-efficient perspective; it is, with the use of power management techniques. This paper describes some of the low power design strategies of the PowerPC™970 microprocessor in the aforementioned two directions: technology scaling and power management. The goal is to show that power efficiency requires a global strategy addressing simultaneously different levels of abstractions.
Keywords
integrated circuit design; integrated circuit reliability; low-power electronics; microprocessor chips; power consumption; thermal management (packaging); architectural power optimizations; microprocessors; mobile devices; packaging cost; power consumption; power management; reliability; suitability; technological optimizations; technology scaling; thermal management; Circuits; Costs; Energy consumption; Energy management; Microprocessors; Packaging; Power dissipation; Power system economics; Technology management; Thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Signals, Circuits and Systems, 2005. ISSCS 2005. International Symposium on
Print_ISBN
0-7803-9029-6
Type
conf
DOI
10.1109/ISSCS.2005.1509838
Filename
1509838
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