• DocumentCode
    2035155
  • Title

    Technological and architectural power optimizations for advance microprocessors

  • Author

    Lichtenau, Cédric ; Ortiz, Alberto Garcia ; Pflüger, Thomas

  • Author_Institution
    IBM Deutschland, Boeblingen, Germany
  • Volume
    1
  • fYear
    2005
  • fDate
    14-15 July 2005
  • Firstpage
    11
  • Abstract
    Reliability, thermal management, packaging cost, and suitability for mobile devices, are making power consumption a main concern for high-end microprocessors. In order to tackle this problem, power efficient design techniques addressing all the abstraction levels are required. To satisfy the demands of increasing functionality and higher processing power, the design of high-end microprocessor must face two main challenges. On the one hand, it must be implemented in highly compact nanoscaled technologies. On the other hand, it must handle the increased design complexity, especially from a power-efficient perspective; it is, with the use of power management techniques. This paper describes some of the low power design strategies of the PowerPC970 microprocessor in the aforementioned two directions: technology scaling and power management. The goal is to show that power efficiency requires a global strategy addressing simultaneously different levels of abstractions.
  • Keywords
    integrated circuit design; integrated circuit reliability; low-power electronics; microprocessor chips; power consumption; thermal management (packaging); architectural power optimizations; microprocessors; mobile devices; packaging cost; power consumption; power management; reliability; suitability; technological optimizations; technology scaling; thermal management; Circuits; Costs; Energy consumption; Energy management; Microprocessors; Packaging; Power dissipation; Power system economics; Technology management; Thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signals, Circuits and Systems, 2005. ISSCS 2005. International Symposium on
  • Print_ISBN
    0-7803-9029-6
  • Type

    conf

  • DOI
    10.1109/ISSCS.2005.1509838
  • Filename
    1509838