• DocumentCode
    2035203
  • Title

    Comparison of JEDEC dynamic and static test methods for the thermal characterization of power LEDs

  • Author

    Vass-Varnai, Andras ; Parry, John ; Toth, Gergely ; Ress, S. ; Farkas, Gabor ; Poppe, Andreas ; Rencz, Marta

  • fYear
    2012
  • fDate
    5-7 Dec. 2012
  • Firstpage
    594
  • Lastpage
    597
  • Abstract
    In this paper we review the history of the static (continuous) and dynamic (pulsed) test methods described in JEDEC JESD51-1 [1]. Written in 1995, there has not been, to date and to the knowledge of the authors, any systematic review to these different approaches to the transient thermal testing of packaged ICs and LEDs. Commercially available and in-house test equipment perform either transient thermal testing according to one approach or the other, but not both.
  • Keywords
    dynamic testing; integrated circuit packaging; integrated circuit testing; light emitting diodes; JEDEC JESD51-1 dynamic test methods; JEDEC JESD51-1 static test methods; in-house test equipment; packaged IC transient thermal testing; packaged LED transient thermal testing; power LED; power LED thermal characterization; Electric variables measurement; Light emitting diodes; Pulse measurements; Semiconductor device measurement; Temperature measurement; Time measurement; Transient analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4673-4553-8
  • Electronic_ISBN
    978-1-4673-4551-4
  • Type

    conf

  • DOI
    10.1109/EPTC.2012.6507151
  • Filename
    6507151