DocumentCode :
2035450
Title :
Modeling multilayer power/ground planes in printed circuit boards and electronic packages using microwave networks
Author :
Zhang, Wei Zheng ; Liu, E.X. ; Li, E.P.
Author_Institution :
Inst. of High Performance Comput., A*STAR, Singapore, Singapore
fYear :
2012
fDate :
5-7 Dec. 2012
Firstpage :
637
Lastpage :
640
Abstract :
In the paper, a domain decomposition procedure for the structure of multilayer power/ground planes is presented in the way that the spatial computational domain of PCBs/packages is decomposed as a collection of sub-domains: bounded parallel plane pairs and open plane areas. The pairs and areas are modeled as multiport microwave networks and connected by maintaining the continuity of tangential fields along the boundary of sub-domains. The second contribution of the paper is to propose S-Parameters representing the multiport networks and introduce the connection networks to maintain the continuity of voltages and equivalent currents. Using S-Parameters will make the computation stable while applying (and/or approaching) the boundary conditions of perfect electric conductor (PEC) and perfect magnetic conductor (PMC). The formulation of multiport network of a parallel plane pair is detailed, and how vias and striplines in the parallel plane pair are considered in the formulation is discussed. Finally, the solving method of an interconnected general S-Parameters based microwave network system is presented.
Keywords :
S-parameters; electronics packaging; printed circuit design; PCB-packages; PEC; PMC; bounded parallel plane pairs; current continuity; domain decomposition procedure; electronic packages; equivalent current continuity; interconnected general S-Parameters; multilayer power-ground planes modeling; multiport microwave networks; open plane areas; parallel plane pair multiport network formulation; perfect electric conductor; perfect magnetic conductor; printed circuit boards; spatial computational domain; subdomain boundary; Integrated circuit modeling; Microwave circuits; Nonhomogeneous media; Ports (Computers); Scattering parameters; Stripline;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th
Conference_Location :
Singapore
Print_ISBN :
978-1-4673-4553-8
Electronic_ISBN :
978-1-4673-4551-4
Type :
conf
DOI :
10.1109/EPTC.2012.6507159
Filename :
6507159
Link To Document :
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