Modeling multilayer power/ground planes in printed circuit boards and electronic packages using microwave networks

In the paper, a domain decomposition procedure for the structure of multilayer power/ground planes is presented in the way that the spatial computational domain of PCBs/packages is decomposed as a collection of sub-domains: bounded parallel plane pairs and open plane areas. The pairs and areas are modeled as multiport microwave networks and connected by maintaining the continuity of tangential fields along the boundary of sub-domains. The second contribution of the paper is to propose S-Parameters representing the multiport networks and introduce the connection networks to maintain the continuity of voltages and equivalent currents. Using S-Parameters will make the computation stable while applying (and/or approaching) the boundary conditions of perfect electric conductor (PEC) and perfect magnetic conductor (PMC). The formulation of multiport network of a parallel plane pair is detailed, and how vias and striplines in the parallel plane pair are considered in the formulation is discussed. Finally, the solving method of an interconnected general S-Parameters based microwave network system is presented.