DocumentCode
2035469
Title
High power thick film circuitry on PECOS (porcelain enamel coating on steel) substrates
Author
Giesecke, Daniel ; Gleason, Lawrence ; Field, Robert ; Genis, Alan
Author_Institution
Ohmite Manuf. Co., Skokie, IL, USA
fYear
1994
fDate
10-12 May 1994
Firstpage
847
Lastpage
854
Abstract
The need for high power density microcircuits has increased interest in the thermal and electrical characteristics of Porcelain Enamel Coatings on Steel (PECOS) for use as a substrate material. This high temperature substrate has been found to be compatible with most thick film inks which are presently available. The electrical and thermal characteristics are presented for a very compact line of low inductance sheet power resistors fabricated on the PECOS substrate and compared to similar power resistors fabricated on conventional alumina substrates. A two-dimensional finite volume heat transfer model has been developed for steady state power dissipation including convection and radiant energy transfer mechanisms. Computer analysis from the heat transfer model and predicted temperatures are compared to temperatures measured utilizing an infrared imaging system
Keywords
equivalent circuits; heat transfer; integrated circuit technology; steel; substrates; temperature distribution; thermal analysis; thick film circuits; thick film resistors; 2D finite volume heat transfer model; FeCr; PECOS substrate; convection transfer mechanism; electrical characteristics; high power density microcircuits; high power thick film circuitry; high temperature substrate material; low inductance sheet power resistors; porcelain enamel coating on steel; radiant energy transfer mechanism; steady state power dissipation; temperature prediction; thermal characteristics; thick film inks; Coatings; Heat transfer; Infrared heating; Porcelain; Power system modeling; Resistors; Substrates; Temperature; Thick film circuits; Thick films;
fLanguage
English
Publisher
ieee
Conference_Titel
Electro/94 International. Conference Proceedings. Combined Volumes.
Conference_Location
Boston, MA
Print_ISBN
0-7803-2630-X
Type
conf
DOI
10.1109/ELECTR.1994.472638
Filename
472638
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