• DocumentCode
    2035469
  • Title

    High power thick film circuitry on PECOS (porcelain enamel coating on steel) substrates

  • Author

    Giesecke, Daniel ; Gleason, Lawrence ; Field, Robert ; Genis, Alan

  • Author_Institution
    Ohmite Manuf. Co., Skokie, IL, USA
  • fYear
    1994
  • fDate
    10-12 May 1994
  • Firstpage
    847
  • Lastpage
    854
  • Abstract
    The need for high power density microcircuits has increased interest in the thermal and electrical characteristics of Porcelain Enamel Coatings on Steel (PECOS) for use as a substrate material. This high temperature substrate has been found to be compatible with most thick film inks which are presently available. The electrical and thermal characteristics are presented for a very compact line of low inductance sheet power resistors fabricated on the PECOS substrate and compared to similar power resistors fabricated on conventional alumina substrates. A two-dimensional finite volume heat transfer model has been developed for steady state power dissipation including convection and radiant energy transfer mechanisms. Computer analysis from the heat transfer model and predicted temperatures are compared to temperatures measured utilizing an infrared imaging system
  • Keywords
    equivalent circuits; heat transfer; integrated circuit technology; steel; substrates; temperature distribution; thermal analysis; thick film circuits; thick film resistors; 2D finite volume heat transfer model; FeCr; PECOS substrate; convection transfer mechanism; electrical characteristics; high power density microcircuits; high power thick film circuitry; high temperature substrate material; low inductance sheet power resistors; porcelain enamel coating on steel; radiant energy transfer mechanism; steady state power dissipation; temperature prediction; thermal characteristics; thick film inks; Coatings; Heat transfer; Infrared heating; Porcelain; Power system modeling; Resistors; Substrates; Temperature; Thick film circuits; Thick films;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electro/94 International. Conference Proceedings. Combined Volumes.
  • Conference_Location
    Boston, MA
  • Print_ISBN
    0-7803-2630-X
  • Type

    conf

  • DOI
    10.1109/ELECTR.1994.472638
  • Filename
    472638