• DocumentCode
    2035493
  • Title

    Compact triple-mode microstrip bandpass filter

  • Author

    Songbai Zhang ; Lei Zhu ; Rui Li ; Cheng Jin

  • Author_Institution
    Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
  • fYear
    2012
  • fDate
    5-7 Dec. 2012
  • Firstpage
    641
  • Lastpage
    644
  • Abstract
    In this paper, a novel I/O stage coupling scheme is presented for exploration of a microstrip triple-mode bandpass filter with improved out-of-band rejection performance. Firstly, a modified microstrip triple-mode stub-loaded resonator is formed by tap-connecting a λ/2 microstrip line resonator with a pair of open-circuited stubs of less than λ/4 in length at its two symmetrical positions. As such, three resonant modes are properly excited to make up a three-pole passband, above which a transmission zero attributed to the virtual ground of open-circuited stub is produced as well. Next, these two stubs are flared apart not only to avoid harmful parasitic coupling, but also to create an additional pair of transmission zeros in the lower stopband. As a result, a triple-mode bandpass filter, which is self-contained with two transmission zeros at both upper and lower stopbands, is theoretically constituted. Finally, the proposed microstrip triple-mode bandpass filter is designed and fabricated to provide an experimental validation for the predicted frequency responses.
  • Keywords
    band-pass filters; frequency response; microstrip filters; microstrip lines; microstrip resonators; resonator filters; λ/2 microstrip line resonator; I/O stage coupling scheme; compact triple-mode microstrip bandpass filter; frequency response; microstrip triple-mode stub-loaded resonator; open-circuited stub; out-of-band rejection performance; parasitic coupling; resonant mode; tap-connecting; three-pole passband; transmission zero; virtual ground; Conferences; DVD; Decision support systems; Electronics packaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4673-4553-8
  • Electronic_ISBN
    978-1-4673-4551-4
  • Type

    conf

  • DOI
    10.1109/EPTC.2012.6507160
  • Filename
    6507160