Title :
Eliminating CFC usage for multichip module cleaning: a users experience in choosing an alternate solution
Author :
Johnson, Dean P.
Author_Institution :
Tandem Comput. Inc., Cupertino, CA, USA
Abstract :
Tandem´s VLSI technology development laboratory shut down its CFC (chlorofluorocarbon) degreaser in December 1990. The author discusses the materials and equipment issues that were considered in developing a non-CFC cleaning process for multichip modules. Tandem´s solution is discussed in connection with the choice of a semi-aqueous solvent, the batch-type immersion equipment that was chosen, and environmental concerns
Keywords :
hybrid integrated circuits; integrated circuit manufacture; modules; packaging; surface treatment; CFC usage elimination; Tandem; batch-type immersion equipment; chlorofluorocarbon; environmental concerns; multichip module cleaning; nonCFC cleaning process; semiaqueous solvent; Bonding; Cleaning; Computer aided manufacturing; Contamination; Material storage; Multichip modules; Packaging machines; Silicon; Solvents; Wire;
Conference_Titel :
Electronic Components and Technology Conference, 1991. Proceedings., 41st
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-0012-2
DOI :
10.1109/ECTC.1991.163906
