• DocumentCode
    2035803
  • Title

    Implantable blood flow sensor integrated on flexible circuit for vascular graft application

  • Author

    Li Shiah Lim ; Jia Hao Cheong ; Jerry, J.L.A. ; He, Chu

  • Author_Institution
    Inst. of Microelectron., A*STAR (Agency for Sci., Technol. & Res.), Singapore, Singapore
  • fYear
    2012
  • fDate
    5-7 Dec. 2012
  • Firstpage
    695
  • Lastpage
    699
  • Abstract
    This paper reports an implantable blood flow sensor system integrated on flexible circuit that consists of pressure sensor and inductively powered wireless sensor interface Application Specific Integrated Circuit (ASIC) for early graft failure detection application. The proposed system was embedded within the vascular graft to have continuously monitoring the differential blood pressure change as an indication of stenosis build- up in the graft. The fabricated pressure sensor is showed the step of 0.5psi of pressure changes is clearly visible with the resistance change. The resolution of pressure change 8mmHg was achieved. [1] The whole system was successfully integrated on designed flexible circuit by optimizing method of flip-chip bonding with gold stud bump and underfill encapsulant at lower temperature. The assembled system was successfully demonstrated wirelessly.
  • Keywords
    application specific integrated circuits; biomedical electronics; biosensors; flip-chip devices; flow sensors; pressure sensors; prosthetics; ASIC; application specific integrated circuit; blood pressure; flexible circuit; flip-chip bonding; gold stud bump; graft failure detection; implantable blood flow sensor; inductively powered wireless sensor interface; pressure sensor; underfill encapsulant; vascular graft; Application specific integrated circuits; Blood flow; Bonding; Flip-chip devices; Force; Gold; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4673-4553-8
  • Electronic_ISBN
    978-1-4673-4551-4
  • Type

    conf

  • DOI
    10.1109/EPTC.2012.6507171
  • Filename
    6507171